1. 不(bu)銹鋼化學鍍銅的應用(yong)
不銹(xiu)鋼化學鍍銅應用于電(dian)(dian)子(zi)工業、計算機工業及(ji)航空(kong)工業中電(dian)(dian)子(zi)元件的高效電(dian)(dian)磁干擾的屏蔽。
2. 不銹鋼基體上(shang)化(hua)學(xue)鍍銅存在的問題
香蕉視頻app連接:不銹鋼基體上化學鍍銅易造成鍍層鼓泡，這不僅影響了鍍層與基體的結合力，而且直接影響到外觀質量。為此，將鍍前酸處理過的不銹鋼放在烘箱中加熱，以除去酸洗時滲入到基體的氫，采用此方法解決了鍍層起泡問題，得到所需要的化學鍍銅層。
3. 不銹(xiu)鋼化學鍍銅(tong)工藝流(liu)程
NiCr不銹鋼（經(jing)過600℃真空(kong)熱(re)處(chu)理）→化學除(chu)油［氫氧化鈉（NaOH)10%(質量分數）］→水(shui)(shui)洗→熱(re)水(shui)(shui)洗→除(chu)銹（鹽(yan)酸(suan)1:1溶液，溫(wen)(wen)度(du)(du)80~100℃,時(shi)間5min)→水(shui)(shui)洗→干燥→除(chu)氫（在烘箱中溫(wen)(wen)度(du)(du)200℃,時(shi)間2h)→酸(suan)處(chu)理［稀硫酸(suan)5%(質量分數），時(shi)間1~5min]→水(shui)(shui)洗→去離(li)子水(shui)(shui)洗→化學鍍銅→水(shui)(shui)洗→抗銅變色處(chu)理（苯并三氮(dan)唑(zuo)1g/L,溫(wen)(wen)度(du)(du)65℃,時(shi)間2min)→純水(shui)(shui)洗→熱(re)純水(shui)(shui)洗→干燥。
4. 化學鍍(du)銅溶液成分及工藝條件見表4-39
5. 化學(xue)鍍銅(tong)溶液的(de)配制
先將硫酸(suan)銅(tong)和酒(jiu)石(shi)酸(suan)鉀鈉分別用(yong)(yong)純水(shui)溶(rong)(rong)(rong)解，然后(hou)(hou)將硫酸(suan)銅(tong)溶(rong)(rong)(rong)液(ye)(ye)在攪(jiao)(jiao)拌下加(jia)入(ru)酒(jiu)石(shi)酸(suan)鉀鈉溶(rong)(rong)(rong)液(ye)(ye)中(zhong)，銅(tong)離(li)子被(bei)酒(jiu)石(shi)酸(suan)離(li)子絡(luo)(luo)合成藍色絡(luo)(luo)合物(wu)。再將氯化鎳用(yong)(yong)少量水(shui)溶(rong)(rong)(rong)解后(hou)(hou)攪(jiao)(jiao)拌加(jia)入(ru)，再加(jia)入(ru)甲醛溶(rong)(rong)(rong)液(ye)(ye)，攪(jiao)(jiao)拌均勻。將氫氧化鈉用(yong)(yong)純水(shui)溶(rong)(rong)(rong)解成200g/L 的濃(nong)溶(rong)(rong)(rong)液(ye)(ye)待用(yong)(yong)。在開始化學(xue)鍍銅(tong)前，逐步在攪(jiao)(jiao)拌下加(jia)入(ru)藍色絡(luo)(luo)合液(ye)(ye)中(zhong)，使(shi)溶(rong)(rong)(rong)液(ye)(ye)pH達(da)到(dao)12 左右（用(yong)(yong)9~13精密pH試紙測量），最后(hou)(hou)將穩(wen)定劑亞(ya)鐵氯化鉀、聚乙二醇用(yong)(yong)少量水(shui)溶(rong)(rong)(rong)解后(hou)(hou)攪(jiao)(jiao)拌加(jia)入(ru)，乙醇可直接加(jia)入(ru)，最后(hou)(hou)用(yong)(yong)純水(shui)加(jia)入(ru)至(zhi)溶(rong)(rong)(rong)液(ye)(ye)的規定體積，攪(jiao)(jiao)拌均勻后(hou)(hou)放入(ru)不(bu)銹鋼件即可開始化學(xue)鍍銅(tong)。
6. 操作(zuo)要點
①. 裝載量
按照每升鍍液裝載(zai)2d㎡計算(suan)。
②. 除氫和(he)攪(jiao)拌
不(bu)銹鋼對(dui)氫(qing)(qing)(qing)滲(shen)(shen)很敏感，工(gong)件(jian)在(zai)酸(suan)(suan)洗(xi)過(guo)(guo)程中(zhong)(zhong)氫(qing)(qing)(qing)會滲(shen)(shen)人到基體(ti)(ti)中(zhong)(zhong)，如果不(bu)除(chu)(chu)氫(qing)(qing)(qing)，化(hua)(hua)學鍍(du)(du)銅(tong)鍍(du)(du)層(ceng)(ceng)致密小孔覆蓋在(zai)不(bu)銹鋼表(biao)(biao)面(mian)后，氫(qing)(qing)(qing)氣無法(fa)逸(yi)出，造(zao)成很大的(de)(de)(de)(de)(de)(de)應(ying)力，使(shi)(shi)鍍(du)(du)層(ceng)(ceng)起泡，加上(shang)化(hua)(hua)學鍍(du)(du)銅(tong)本(ben)身伴隨著析氫(qing)(qing)(qing)過(guo)(guo)程，氫(qing)(qing)(qing)氣會殘(can)留(liu)在(zai)基體(ti)(ti)與鍍(du)(du)層(ceng)(ceng)金屬(shu)的(de)(de)(de)(de)(de)(de)晶格(ge)(ge)中(zhong)(zhong)，增(zeng)大內應(ying)力，嚴重(zhong)地(di)減(jian)弱基體(ti)(ti)與鍍(du)(du)層(ceng)(ceng)的(de)(de)(de)(de)(de)(de)結(jie)合強(qiang)度(du)(du)。為此，從兩(liang)方面(mian)著手解決鍍(du)(du)層(ceng)(ceng)起泡問題。其一(yi)是(shi)把經(jing)過(guo)(guo)去(qu)油、酸(suan)(suan)洗(xi)后的(de)(de)(de)(de)(de)(de)工(gong)件(jian)在(zai)化(hua)(hua)學鍍(du)(du)銅(tong)前進行熱處理(li)(li)，除(chu)(chu)去(qu)滲(shen)(shen)入(ru)到基體(ti)(ti)中(zhong)(zhong)的(de)(de)(de)(de)(de)(de)氫(qing)(qing)(qing)，熱處理(li)(li)溫(wen)度(du)(du)和時(shi)(shi)間條件(jian)經(jing)實驗(yan)確定為180~200℃,2小時(shi)(shi)，鍍(du)(du)層(ceng)(ceng)無鼓泡，鍍(du)(du)層(ceng)(ceng)結(jie)合力合格(ge)(ge)。溫(wen)度(du)(du)過(guo)(guo)低或(huo)時(shi)(shi)間過(guo)(guo)短仍有輕(qing)微鼓泡，溫(wen)度(du)(du)過(guo)(guo)高或(huo)時(shi)(shi)間過(guo)(guo)長都容易使(shi)(shi)表(biao)(biao)面(mian)再次生成不(bu)易去(qu)除(chu)(chu)的(de)(de)(de)(de)(de)(de)氧化(hua)(hua)皮，又需(xu)要較長時(shi)(shi)間的(de)(de)(de)(de)(de)(de)強(qiang)酸(suan)(suan)處理(li)(li)，酸(suan)(suan)洗(xi)時(shi)(shi)氫(qing)(qing)(qing)會再次滲(shen)(shen)入(ru)基體(ti)(ti)。在(zai)所(suo)選定的(de)(de)(de)(de)(de)(de)溫(wen)度(du)(du)和時(shi)(shi)間下雖表(biao)(biao)面(mian)會有新(xin)的(de)(de)(de)(de)(de)(de)氧化(hua)(hua)膜生成，但使(shi)(shi)用稀(xi)硫酸(suan)(suan)短時(shi)(shi)間酸(suan)(suan)洗(xi)即可，以免再次滲(shen)(shen)氫(qing)(qing)(qing)。其二是(shi)在(zai)化(hua)(hua)學鍍(du)(du)銅(tong)過(guo)(guo)程中(zhong)(zhong)，采(cai)用某(mou)種攪(jiao)(jiao)拌（空氣攪(jiao)(jiao)拌或(huo)機械攪(jiao)(jiao)拌），有利于銅(tong)離子向(xiang)工(gong)件(jian)表(biao)(biao)面(mian)擴散(san)，防止和減(jian)少副反(fan)應(ying)產物銅(tong)粉（即Cu2O)的(de)(de)(de)(de)(de)(de)生成，而且(qie)有利于反(fan)應(ying)產物氫(qing)(qing)(qing)氣脫離工(gong)件(jian)表(biao)(biao)面(mian)。通過(guo)(guo)上(shang)述(shu)兩(liang)種方法(fa)有效地(di)解決了鍍(du)(du)層(ceng)(ceng)鼓泡問題，提高了鍍(du)(du)層(ceng)(ceng)與基體(ti)(ti)的(de)(de)(de)(de)(de)(de)結(jie)合強(qiang)度(du)(du)。
③. 催化活(huo)性(xing)劑-鎳(nie)離子
在化(hua)學鍍(du)銅溶液(ye)中(zhong)(zhong)加入(ru)少量(liang)鎳離(li)子后，鍍(du)層(ceng)性質得到改善，在鍍(du)銅層(ceng)中(zhong)(zhong)含(han)有(you)(you)微量(liang)的(de)鎳，形成Cu89Ni11金(jin)屬化(hua)合(he)物，它具有(you)(you)最(zui)佳(jia)的(de)催化(hua)活性，提高鍍(du)層(ceng)的(de)催化(hua)活性。
④. 穩(wen)定(ding)劑的控制
在化(hua)(hua)(hua)學(xue)鍍(du)(du)(du)銅過程(cheng)中，甲(jia)醛(quan)能將二價(jia)銅離子還原為(wei)金(jin)屬銅鍍(du)(du)(du)層，還存在有(you)副(fu)反應，即(ji)不完全(quan)反應生成(cheng)(cheng)暗紅(hong)色的(de)(de)(de)氧化(hua)(hua)(hua)亞(ya)(ya)銅（Cu2O),它形成(cheng)(cheng)微(wei)粒懸浮(fu)在鍍(du)(du)(du)液中，呈膠(jiao)體狀態，極難(nan)用過濾除去，若與銅共沉積，使(shi)銅鍍(du)(du)(du)層疏松粗糙，與基(ji)體結合力極差(cha)。氧化(hua)(hua)(hua)亞(ya)(ya)銅被甲(jia)醛(quan)還原成(cheng)(cheng)金(jin)屬微(wei)粒，又(you)(you)成(cheng)(cheng)為(wei)自(zi)催化(hua)(hua)(hua)中心，使(shi)鍍(du)(du)(du)液自(zi)發分解，消(xiao)耗了鍍(du)(du)(du)液中的(de)(de)(de)有(you)效成(cheng)(cheng)分。為(wei)了抑制副(fu)反應的(de)(de)(de)發生，加(jia)入穩(wen)定(ding)劑，以(yi)提(ti)高鍍(du)(du)(du)液的(de)(de)(de)穩(wen)定(ding)性(xing)。但是(shi)，過量的(de)(de)(de)穩(wen)定(ding)劑的(de)(de)(de)加(jia)人，又(you)(you)成(cheng)(cheng)了化(hua)(hua)(hua)學(xue)鍍(du)(du)(du)銅反應的(de)(de)(de)催化(hua)(hua)(hua)毒(du)性(xing)劑，顯(xian)著降低化(hua)(hua)(hua)學(xue)鍍(du)(du)(du)的(de)(de)(de)速率(lv)，甚至停(ting)鍍(du)(du)(du)，故(gu)選用穩(wen)定(ding)劑，并控制其很低的(de)(de)(de)適宜含量，對提(ti)高鍍(du)(du)(du)液穩(wen)定(ding)性(xing)有(you)效。
⑤. 防銅層變色(se)處(chu)理
對(dui)銅(tong)(tong)層(ceng)(ceng)進行防(fang)(fang)變(bian)色(se)處(chu)理(li)，在(zai)鍍銅(tong)(tong)層(ceng)(ceng)表面(mian)形(xing)成一層(ceng)(ceng)穩定的絡合膜，隔絕外界浸蝕性物質對(dui)鍍銅(tong)(tong)層(ceng)(ceng)的作用(yong)，使(shi)鍍銅(tong)(tong)層(ceng)(ceng)保持本色(se)一定的時(shi)(shi)間。苯(ben)并三氮唑要(yao)先用(yong)乙醇溶解(jie)好，然后加入(ru)熱蒸餾水中。防(fang)(fang)變(bian)色(se)處(chu)理(li)的溫度不(bu)低于(yu)65℃,時(shi)(shi)間不(bu)少于(yu)2min,否則(ze)防(fang)(fang)變(bian)色(se)達不(bu)到效果。
7. 鍍層結(jie)合(he)強度檢測－劃痕實驗法
在(zai)鍍層表面用刀片劃(hua)(hua)出1mm間距的直行線和90°交錯(cuo)的橫行線形(xing)成小方格(ge)。觀察劃(hua)(hua)痕交錯(cuo)處鍍層有(you)無起(qi)層，進(jin)一(yi)步用黏性高(gao)的膠帶(dai)貼于劃(hua)(hua)痕表面，再撕下膠帶(dai)，以銅層不脫(tuo)落為合格(ge)。
8. 不銹(xiu)鋼(gang)化學鍍銅常見故(gu)障、可能原因及糾正方法見表4-40.
